SOLIDWORKS Flow Simulation - Thermal Analysis of an Electronics Enclosure

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See more at: http://www.goengineer.com/products/flow-simulation/ Learn about how to use SOLIDWORKS Flow Simulation and the Electronics Cooling Module to do a Thermal Analysis on an Electronics Enclosure. Some of the features used are two resistor components, heat sinks, fans, packages, and PCBs. WEbinar presented by ARvind Krishnan of GoEngineer. About GoEngineer: GoEngineer delivers software, technology and expertise that enable companies to unlock innovation and deliver better products faster. With more than 30 years experience and thousands of customers in high-tech, medical, machine design, energy and other industries, GoEngineer provides best-in-class design solutions from SOLIDWORKS, Stratasys, CAMWorks and Agile PLM. http://www.goengineer.com http://www.facebook.com/goengineer http://www.twitter.com/goengineer http://www.linkedin.com/goengineer https://plus.google.com/+goengineer